Difference Between Electroplating And Electroless Plating Pdf

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difference between electroplating and electroless plating pdf

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The added layer of metal protects the underlying core material from moisture while improving its appearance in the process. While there are numerous types of plating process, most can be categorized as either electroplating or electroless plating. Both types are able to add a layer of metal over a surface, but the way in which they do so varies.

Real time monitoring of electroless nickel plating. This work deals with the design and manufacturing of the heat and chemical resistant transducer case required for on-line immersion testing, experimental design, data acquisition and signal processing. Results are presented for several depositions with an accuracy of two ten-thousandths of an inch in coating thickness obtained.

Electroless nickel-phosphorus plating

With lead-free legislation impacting PCB manufacturing, immersion silver finish is adapted as one of the top finish of copper trace on PCB due to its many advantages. At the same time, driven by cost pressure, the silver electroplating is also considered to replace gold plating on electrical contacts of connectors. Therefore, there is a potential risk for silver finish to form electrochemical migration ECM under certain potential bias in high humid environment. The effects of the silver plating processes on PCB and connectors, and the thickness, porosity, defects of silver finish, as well as the underplating and substrate materials will increase the complexity of ECM.

In this study, possible chemical reactions happened on the silver electrodes were analyzed theoretically based on the analysis of plating processes and detection of porosity and defects. The time to failure caused by ECM was quantitatively calculated by the change of surface insulation resistance between the electrodes with potential bias.

The failure mechanisms of ECM both on electroless silver plated PCB and on silver electroplated conductors were compared by element compositions and growth stages of migration dendrites, as well as polarization performance of different material combinations. The influencing factors on ECM, such as the potential bias, the thickness of silver plating, underplating nickel, substrate copper, were also discussed.

This is a preview of subscription content, access via your institution. Rent this article via DeepDyve. Zhou, Failure mechanism of gold-plated contacts in mobile phones under dust contamination jointing with micromotion condition.

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Yang, C. Yuan, Y. Huo, Electrochemical migration failure of the copper trace on printed circuit board driven by immersion silver finish. Download references. Correspondence to Yilin Zhou. Reprints and Permissions. Zhou, Y. The comparison of electrochemical migration mechanism between electroless silver plating and silver electroplating. J Mater Sci: Mater Electron 27, — Download citation.

Received : 26 July Accepted : 05 October Published : 12 October Issue Date : January Search SpringerLink Search. Immediate online access to all issues from Subscription will auto renew annually. R eferences 1. Lucero, Effects of accelerated storage environments on the solderability of immersion silver-coated printed circuit boards, in Pan Pacific Symposium , Hawaii, 17 Jan, 8.

View author publications. Rights and permissions Reprints and Permissions. About this article. Cite this article Zhou, Y.

Different Types of Plating and Their Effect on the End Product

The primary difference with the nickel plating process is that EN does not require the application of an external electrical current to drive the deposition as does electrolytic nickel. Rather, EN uses a chemical reducing agent within the solution chemistry which results in nearly uniform deposition on all surfaces that are wetted by the EN chemistry. Since the electrolytic nickel plating process requires the application of an externally applied DC current, the deposit tends to be non-uniform with excess deposit on the edges or corners high current areas of the part. An additional difference is that EN is an amorphous alloy of nickel and phosphorous. The addition of phosphorous provides the deposit with more corrosion resistance, less magnetic properties high phosphorous varieties and a lower coefficient of friction than electrolytic nickel. The application of post-plate heat treatment of EN causes the formation of nickel phosphides at grain boundaries which further hardens the deposit to as high as 69 Rc.

Plating is the process of covering the surface of a material or workpiece with a different metal. Plating provides a number of useful benefits, such as inhibiting corrosion, changing conductibility, improving wear, boosting solderability, reducing friction, heat resistance, and hardening the material. Electroplating is the most common method of plating. Electroplating uses an electrical current to dissolve positively charged metal particles ions in a chemical solution. The positively charged metal ions are attracted to the material to be plated, which is the negatively charged side of the circuit. The part or product to be plated is then placed in this solution, and the dissolved metal particles are drawn to the surface of the material. Electroplating results in a smooth, even and rapid coating for the material that is plated, effectively changing the surface of the material.

When choosing your form of plating, you need to know the differences in electroplating vs. Some projects will benefit more from electroless plating, also known as autocatalytic, than from electrolytic. Before you make a major decision on how your parts get finished, learn more about the coating options you have for a metal surface. What Is the Process of Nickel Plating? What Is Electrolytic Plating?

So, what IS the.

Electroless (Autocatalytic) Vs Electrolytic Plating

For this, we can use the electroplating and electro less plating. So, you have to do electroplating and electro less plating of different conducting and non- conducting materials. Also, compare and analyze the result of both. The types of plating: 1. Electroplating with current as an external source 2.

Electroless nickel-phosphorus plating is a chemical process that deposits an even layer of nickel - phosphorus alloy on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing nickel salt and a phosphorus-containing reducing agent , usually a hypophosphite salt. A similar process uses a borohydride reducing agent, yielding a nickel- boron coating instead.